Chip design job offers in andhra pradesh

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  • Senior IC Packaging Engineer (Hyderabad)

    new Axiado Hyderabad, Andhra Pradesh

    ...(UCIe). Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies,
    1 day ago in Kitjob_in

    Report
  • Senior IC Packaging Engineer (Rajahmundry)

    new Axiado Rajahmundry, Andhra Pradesh

    ...(UCIe). Solid understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies,
    1 day ago in Kitjob_in

    Report
  • Senior IC Packaging Engineer (Secunderabad)

    new Axiado Secunderabad, Hyderabad, Andhra Pradesh

    ...(UCIe). Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies,
    1 day ago in Kitjob_in

    Report
  • Senior IC Packaging Engineer (Tirupati)

    new Axiado Tirupati, Andhra Pradesh  +1 Location

    ...(UCIe). Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies,
    1 day ago in Kitjob_in

    Report
  • Head of NPI (New Product Introduction) / Integration (Tirupa

    new Tata Electronics Tirupati, Andhra Pradesh  +36 locations

    ...Six Sigma methodologies for NPI execution. Manufacturing & Process Engineering. Experience with flip-chip, wire bonding, die attach, molding, and test process
    1 day ago in Kitjob_in

    Report
  • Head of NPI (New Product Introduction) / Integration (Guntur

    new Tata Electronics Guntur, Andhra Pradesh  +36 locations

    ...Six Sigma methodologies for NPI execution. Manufacturing & Process Engineering. Experience with flip-chip, wire bonding, die attach, molding, and test process
    1 day ago in Kitjob_in

    Report
  • Head of NPI (New Product Introduction) / Integration (Eluru)

    new Tata Electronics Eluru, Andhra Pradesh  +36 locations

    ...Six Sigma methodologies for NPI execution. Manufacturing & Process Engineering. Experience with flip-chip, wire bonding, die attach, molding, and test process
    1 day ago in Kitjob_in

    Report
  • OPC (Optical Proximity Correction) Head (Kadapa)

    new Tata Electronics Cuddapah, Andhra Pradesh  +4 locations

    ...Technology Development team, Design Enablement team, Lithography / Etch teams and develop Computational OPC solutions. To conceptualize thru pitch structures,
    1 day ago in Kitjob_in

    Report
  • Head of NPI (New Product Introduction) / Integration (Ananta

    new Tata Electronics Anantapur, Andhra Pradesh  +5 locations

    ...Six Sigma methodologies for NPI execution. Manufacturing & Process Engineering. Experience with flip-chip, wire bonding, die attach, molding, and test process
    1 day ago in Kitjob_in

    Report
  • Head of NPI (New Product Introduction) / Integration (Secund

    new Tata Electronics Secunderabad, Hyderabad, Andhra Pradesh

    ...Six Sigma methodologies for NPI execution. Manufacturing & Process Engineering. Experience with flip-chip, wire bonding, die attach, molding, and test process
    1 day ago in Kitjob_in

    Report
  • OPC (Optical Proximity Correction) Head (Anantapur)

    new Tata Electronics Anantapur, Andhra Pradesh  +5 locations

    ...with Technology Development team, Design Enablement team, Lithography / Etch teams and develop Computational OPC solutions. To conceptualize thru pitch
    1 day ago in Kitjob_in

    Report
  • OPC (Optical Proximity Correction) Head (Kakinada)

    new Tata Electronics Kakinada, Andhra Pradesh  +2 locations

    ...Technology Development team, Design Enablement team, Lithography / Etch teams and develop Computational OPC solutions. To conceptualize thru pitch structures,
    1 day ago in Kitjob_in

    Report
  • Head of NPI (New Product Introduction) / Integration (Srikak

    new Tata Electronics Srikakulam, Andhra Pradesh

    ...Six Sigma methodologies for NPI execution. Manufacturing & Process Engineering. Experience with flip-chip, wire bonding, die attach, molding, and test process
    1 day ago in Kitjob_in

    Report
  • Head of NPI (New Product Introduction) / Integration (Vijaya

    new Tata Electronics Vijayawada, Andhra Pradesh

    ...Six Sigma methodologies for NPI execution. Manufacturing & Process Engineering. Experience with flip-chip, wire bonding, die attach, molding, and test process
    1 day ago in Kitjob_in

    Report
  • OPC (Optical Proximity Correction) Head (Eluru)

    new Tata Electronics Eluru, Andhra Pradesh  +2 locations

    ...Technology Development team, Design Enablement team, Lithography / Etch teams and develop Computational OPC solutions. To conceptualize thru pitch structures,
    1 day ago in Kitjob_in

    Report
  • Senior / Staff/ Principal Engineer, DPG Tech Verification (H

    Micron Hyderabad, Andhra Pradesh

    ...set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design...
    2 days ago in Kitjob_in

    Report
  • Research And Development Manager (Anantapur)

    Walker Digital Table Systems Anantapur, Andhra Pradesh

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
  • Digital -GenAI - AI/LLM platform & Devops & Azure (Hyderabad

    new Qnity Hyderabad, Andhra Pradesh

    ...Design and implement CI/CD pipelines for AI and cloud-native applications. Architect and optimize Hybrid Search solutions (BM25 + Vector + Metadata...
    1 day ago in Kitjob_in

    Report
  • Research And Development Manager (Rajahmundry)

    Walker Digital Table Systems Rajahmundry, Andhra Pradesh

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
  • Research And Development Manager (Kakinada Port)

    Walker Digital Table Systems Kakinada, Andhra Pradesh

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
  • Research And Development Manager (Srikakulam)

    Walker Digital Table Systems Srikakulam, Andhra Pradesh  +1 Location

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
  • Research And Development Manager (Nellore)

    Walker Digital Table Systems Nellore, Andhra Pradesh  +1 Location

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
  • Research And Development Manager (Hyderabad)

    Walker Digital Table Systems Hyderabad, Andhra Pradesh

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
  • Research And Development Manager (Kadapa)

    Walker Digital Table Systems Cuddapah, Andhra Pradesh  +14 locations

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
  • Research And Development Manager (Eluru)

    Walker Digital Table Systems Eluru, Andhra Pradesh  +14 locations

    ...for the casino industry. With our patented PJM3.0™ RFID technology, we help casinos enhance revenue, security, and player engagement by enabling real-time chip...
    3 days ago in Kitjob_in

    Report
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Chip design job offers in andhra pradesh

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