Packaging development job offers in hyderabad, andhra pradesh

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  • Live Ops Support Engineer, Prime Video Live Operations, Prim

    new amazon Hyderabad, Andhra Pradesh

    ...development and testing of operational tools that improve efficiency through automation Ownership of one or more systems or tools Customer notification and...
    1 day ago in Kitjob_in

    Report
  • NPI Technology Manager (Flip chip) & Yield Integration (Hyde

    Tata Electronics Hyderabad, Andhra Pradesh  +18 locations

    ...packaging with robust flip chip exposure. Hands on knowledge of Flip chip assembly flows, CTQ, Wafer Bumping & Cu pillar technology, Advanced substrates...
    3 days ago in Kitjob_in

    Report
  • Graphic Designer (Hyderabad)

    SuperAGI Hyderabad, Andhra Pradesh

    ...visual content for print, digital, and branding materials, such as websites, social media graphics, email templates, brochures, advertisements, packaging...
    2 days ago in Kitjob_in

    Report
  • NPI Technology Manager (Flip chip) & Yield Integration (Hyde

    Tata Electronics Hyderabad, Andhra Pradesh  +1 Location

    ...packaging with strong flip chip exposure. Hands on knowledge of Flip chip assembly flows, CTQ, Wafer Bumping & Cu pillar technology, Advanced substrates...
    3 days ago in Kitjob_in

    Report
  • GCP Admin / Consultant Specialist (Hyderabad)

    hsbc Hyderabad, Andhra Pradesh

    ...improvement of processes across the full range of HSBC operations. Should be able to manage multiple GCP projects + Collaborate with application packaging...
    2 days ago in Kitjob_in

    Report
  • Expert, Supply Chain, External Manufacturing Management (Hyd

    new Sanofi Hyderabad, Andhra Pradesh

    ...packaging item changes between CMO and markets, maintain supply chain inventory and records. Relationship Management: Manage relationships with CMO...
    15 h 34 minutes ago in Kitjob_in

    Report
  • NPI Technology Manager (Flip chip) & Yield Integration (Secu

    Tata Electronics Secunderabad, Hyderabad, Andhra Pradesh

    ...packaging with strong flip chip exposure. Hands on knowledge of Flip chip assembly flows, CTQ, Wafer Bumping & Cu pillar technology, Advanced substrates...
    3 days ago in Kitjob_in

    Report
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Packaging development job offers in hyderabad, andhra pradesh

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