10 packaging job offers in state of Assam

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  • Process Lead - OSAT Semiconductor Packaging

    Tata Electronics Assam, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    18 days ago in Jobrapido

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  • Process Lead - OSAT Semiconductor Packaging

    new Tata Electronics Guwahati, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    9 h 12 minutes ago in Talent.com

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  • Process Lead - OSAT Semiconductor Packaging (Dibrugarh)

    Tata Electronics Dibrugarh, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    2 days ago in Kitjob_in

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  • Process Lead - Osat Semiconductor Packaging (Karimganj)

    new Tata Electronics Karimganj, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    1 day ago in Kitjob_in

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  • Process Lead - OSAT Semiconductor Packaging (Assam)

    new Tata Electronics Assam, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    1 day ago in Kitjob_in

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  • (3 Days Left) Process Lead - OSAT Semiconductor Packaging...

    new Tata Electronics Barpeta, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    1 day ago in Kitjob_in

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  • [Apply Now] Process Lead - OSAT Semiconductor Packaging...

    Tata Electronics Goalpara, Assam  +1 Location

    ...(e... JMP, Minitab). Solid communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    2 days ago in Kitjob_in

    Report

  • [Apply Now] Process Lead - OSAT Semiconductor Packaging...

    Tata Electronics Jorhat, Assam  +1 Location

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    2 days ago in Kitjob_in

    Report

  • [Apply Now] Process Lead - OSAT Semiconductor Packaging...

    new Tata Electronics Dibrugarh, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    1 day ago in Kitjob_in

    Report

  • (3 Days Left) Process Lead - OSAT Semiconductor Packaging...

    new Tata Electronics Bongaigaon, Assam

    ...(e... JMP, Minitab). Strong communication and project management skills. Preferred Skills: Experience with QFN, BGA, WLCSP, and Integrated System packaging.
    1 day ago in Kitjob_in

    Report
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